NVIDIA HGX B300 | Central Computers

 

NVIDIA HGX™ B300 NVL8

 

  • Up to 144 petaFLOPs of inference performance
  • Up to 64TB/s of bandwidth per node
  • ConnectX-8 for 800Gb/s external connectivity
  • NVLink internal connectivity
NVIDIA Preferred Partner
ASRock Rack

ASRock Air-Cooled 8U

8U16X-GNR2 B300

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8U16X-TURIN2 B300

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ASRock Liquid-Cooled 4U

4U16X-GNR2/DLC B300

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4U16X-TURIN2/DLC B300

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ASUS Air-Cooled 9U 

XA NB31-E12

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We always strive to bring you the widest selection. 

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HGX B300 NVL8 Eligible for NVIDIA Inception ProgramHGX B300 NVL8 Eligible for NVIDIA Inception Program

Comparison Chart

  • Key Differences:
  • "DLC" on ASRock models refers to "direct liquid cooled". 
Specification *Information is subject to change without notice. Please refer to the manufacturer website for up-to-date details.
Model: ASRock Rack 8U16X-GNR2 B300 ASRock Rack 4U16X-GNR2/DLC B300 ASUS XA NB3I-E12
Form Factor: 8U
930 × 353.6 × 448 mm
36.6" × 13.9" × 17.6"
4U
919 × 175 × 435 mm
36.2" × 6.9" × 17.1"
9U
945 × 394.5 × 447 mm
Motherboard: GNR2D32G-2L+ GNR2D32G-2L+ Z14PN-D32/N
CPU: Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series Processors
1+1 Socket E2 (LGA 4710)
Chipset: System on Chip
Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series Processors
Dual Socket E2 (LGA 4710)
Chipset: System on Chip
2 × Socket 6th Gen Intel® Xeon® Processor Scalable Family
Up to 350W
Memory: 32 × DDR5 slots (16+16 DIMM slots, 2DPC)
DDR5 RDIMM, RDIMM-3DS
DDR5 MRDIMM (1DPC only)
Max. Capacity per DIMM: RDIMM 128GB / RDIMM-3DS 256GB / MRDIMM 64GB
Max. DIMM Frequency: RDIMM & RDIMM-3DS 6400MT/s (1DPC), 5200MT/s (2DPC); MRDIMM 8000MT/s (1DPC only)
Voltage: 1.1V
32 × DDR5 slots (16+16 DIMM slots, 2DPC)
DDR5 RDIMM, RDIMM-3DS
DDR5 MRDIMM
Max. Capacity per DIMM: RDIMM 128GB / MRDIMM 64GB
Max. DIMM Frequency: RDIMM 6400MT/s (1DPC), 5200MT/s (2DPC); RDIMM-3DS 6400MT/s (1DPC), 5200MT/s (2DPC); MRDIMM 8000MT/s (1DPC only)*
*Only available for Intel® Xeon® 6500P/6700P-series processors
Voltage: 1.1V
32 × DDR5 slots (8 channel per CPU, 16 DIMM per CPU)
DDR5 6400 RDIMM / 3DS RDIMM (2DPC)
Memory Size: 128GB, 96GB, 64GB
Max up to 4TB per CPU socket
* Refer to support page for more information
GPU: NVIDIA® HGX™ B300 NVL8 NVIDIA® HGX™ B300 NVL8 NVIDIA HGX B300 288GB 8-GPU Baseboard
Expansion Slots: Rear: 4 × FHHL PCIe 5.0 x16 [PCIe switch] Rear: 2 × FHHL PCIe 5.0 x16 SKU1: 4 × PCIe Gen5 slots [PCIe Switch]: 4 × PCIe Gen5 x16 link
SKU2: 5 × PCIe Gen5 slots [PCIe Switch]: 4 × PCIe Gen5 x16 link, 1 × PCIe Gen5 x8 link (RAID only)
* Supports PCIe x16 link for DPU
** RAID card slot for storage connectivity
M.2: 1 × M-key (PCIe 5.0 x2), supports 22110/2280 form factor [CPU0]
2 × M-key (PCIe 5.0 x4), supports 22110/2280 form factor [CPU1]
1 × M-key (PCIe 5.0 x2), supports 22110/2280 form factor [CPU0]
Storage: Front hot-swap: 12 × 2.5" NVMe (PCIe 5.0 x4) drive bays [PCIe switch] Front hot-swap: 10 × 2.5" NVMe (PCIe 5.0 x4) drive bays [PCIe switch]
Front hot-swap: 2 × 2.5" NVMe (PCIe 5.0 x4) drive bays [CPU]
Optional Kit: Broadcom MegaRAID 9540-8i
PCIe Switch Board: Switch IC: PEX89104
Topology: Synthetic mode for optimized performance of GPU-to-CPU, GPUDirect RDMA NIC, and GPUDirect Storage
Model: ASRock Rack 8U16X-GNR2 B300 ASRock Rack 4U16X-GNR2/DLC B300 ASUS XA NB3I-E12
Networking: 8 × OSFP (800Gb/s) via NVIDIA® ConnectX-8 SuperNIC
2 × RJ45 (1GbE) by Intel® i350, shared with rear I/O
1 × Dedicated IPMI, shared with rear I/O
Intel® i350: 2 × RJ45 (1GbE) 2 × 10GbE LAN ports (Intel X710-AT2 Controller)
1 × Management port
Onboard Graphics: ASPEED AST2600, DDR4 512MB ASPEED AST2600, DDR4 512MB
Front I/O Ports: 8 × OSFP (800Gb/s) via NVIDIA® ConnectX-8 SuperNIC
2 × RJ45 (1GbE) by Intel® i350, shared with rear I/O
1 × Dedicated IPMI, shared with rear I/O
4 × Type-A (USB 3.2 Gen1)
1 × DB15 (VGA)
8 × OSFP (800Gb/s) via NVIDIA® ConnectX®-8 SuperNIC™
2 × RJ45 (1GbE) by Intel i350, shared with rear I/O
1 × Dedicated IPMI, shared with rear I/O
4 × Type-A (USB 3.2 Gen1)
1 × DB15 (VGA)
2 × USB 3.2 ports
1 × VGA port
2 × 10GbE RJ45 LAN port
1 × RJ45 Management LAN port
Front Panel Buttons / LEDs: UID button w/ LED
Power button w/ LED
Reset button
NMI button
System fault LED
HDD activity LED
Power button w/ LED
Reset button
NMI button
UID button
System fault LED
HDD activity LED
1 × Power switch/LED
1 × Location switch/LED
1 × Message LED
1 × Port80 LED (Q-Code)
LAN 1–2 LED (on NIC module)
Rear I/O Ports: 1 × DB15 (VGA)
2 × Type-A (USB 3.2 Gen1)
2 × RJ45 (1GbE) by Intel® i350, shared with front I/O
1 × Dedicated IPMI, shared with front I/O
2 × Type-A (USB 3.2 Gen1)
2 × RJ45 (1GbE) by Intel® i350, shared with front panel
1 × Dedicated IPMI, shared with front panel
Rear Panel LEDs: 1 × UID button/LED
1 × Power button/LED
1 × Reset button
1 × NMI button
1 × HDD activity LED
1 × System fault LED
1 × UID button/LED
1 × Power button/LED
System Management: BMC: ASPEED AST2600, IPMI 2.0 with iKVM and vMedia support
Dedicated IPMI LAN: 1 × Realtek RTL8211F for dedicated management GLAN
BMC: ASPEED AST2600
Dedicated IPMI LAN: 1 × Realtek RTL8211F for dedicated management GLAN
Hardware (out-of-band): Onboard ASMB12-iKVM
Software: ASUS Control Center
Model: ASRock Rack 8U16X-GNR2 B300 ASRock Rack 4U16X-GNR2/DLC B300 ASUS XA NB3I-E12
OS Support: * Refer to https://servers.asus.com/support/os for the latest supported OS list
Regulatory Compliance: CB, CE, FCC, BSMI
Power Supply: 6+6 CRPS, 80 PLUS Titanium
3002.4W @ 220–240 Vac input
2900W @ 200–220 Vac input
AC Input: 200–240 Vrms, 50/60Hz
5+5 CRPS, 80 PLUS Titanium
3002.4W @ 220–240 Vac input
2900W @ 200–220 Vac input
AC Input: 200–240 Vrms, 50/60Hz
5+5 redundant 3200W 80 PLUS Titanium
Fans: 26 × PWM 80×80 mm fans
6 × PWM 60×56 mm fans
2 × PWM 80×80 mm fans
8 × PWM 60×56 mm fans
Weight: Net: 120 kg (CPU, DRAM & HDD not included)
Gross: 150 kg (CPU, DRAM & HDD not included)
System BIOS: AMI UEFI BIOS; 512Mb SPI Flash ROM
Features: Plug and Play, ACPI 4.0 and above compliance wake up events, SMBIOS 3.4 and above, ASRock Rack instant flash
AMI UEFI BIOS; 512Mb SPI Flash ROM
Features: Plug and Play, ACPI 4.0 and above compliance wake up events, SMBIOS 3.4 and above, ASRock Rack instant flash
Hardware Monitor: Temperature: CPU, MB, Card side Temperature Sensing
Fan: Fan Tachometer; CPU Quiet Fan (Auto-Adjust by CPU Temperature); Fan Multi-Speed Control
Voltage: P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
Temperature: CPU, MB, Card side Temperature Sensing
Fan: Fan Tachometer; CPU Quiet Fan (Auto-Adjust by CPU Temperature); Fan Multi-Speed Control
Voltage: P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
Environment: Operating temperature: 10°C ~ 35°C
Non-operating temperature: -40°C ~ 70°C
Non-operating humidity: 20% ~ 90% (Non-condensing)
Operating temperature: 10°C ~ 35°C
Non-operating temperature: -40°C ~ 70°C
Non-operating humidity: 20% ~ 90% (Non-condensing)
Operating temperature: 10°C ~ 35°C
Non-operating temperature: -40°C ~ 70°C
Non-operating humidity: 20% ~ 90% (Non-condensing)
FRU Part List: Z14PN-D32/N: 90SB0E20-M0XBN0
PCIEX5-PLX-C9PB: 90SC0YT0-M0XBN0
CB-C9PB: 90SC0YP0-M0XBN0
PDB-C9PB: 90SC0YU0-M0XBN0
BP10LE32G-25-C9PB: 90SC0YQ0-M0XBN0
CB-FAN-C9PB: 90SC0YR0-M0XBN0
FAN-G-C9PB: 90SC0YS0-M1XBN0
FPB-C9PB: 90SC0YW0-M0XBN0
PWRBRK-C9PB: 90SC0Z00-M0XBN0
CB-OSFP-C2P-I: 90SC0UG0-M1XBN0
CPU CARRIER KIT: 90SKS000-M4EAN0
HEATSINK: 90SKS000-M4JAN0
PSU: 90SKP000-M4DAN0
RAIL KIT: 90SKS000-MMGBN0
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